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Product Introduction
This lead-free superfine wire offers a range of significant advantages for electronic package welding and welding applications with new superfine wires:
The first extremely fine diameter: The wire can be up to 0.1mm in diameter and has a very small cross-section, making it suitable for the precise welding of micro-electronic components, such as chips, circuit boards and other micro-electronic package parts.
The second high-purity material: This ultra-fine welding wire is made of high-purity tin material to ensure the quality and reliability of welding. High purity materials reduce the adverse effects of oxidation and impurities on welding.
Third, fast tin: ultrafine welding wire has fast melting characteristics, making it suitable for fast and efficient welding applications, helping to improve production efficiency.
Fourth, excellent fluidity: The wire has excellent fluidity and can be evenly distributed on the welding surface to ensure that the solder joint is complete and strong, reducing the risk of cold welding and incomplete solder joints.
Fifth low residue: The residue of lead-free ultra-fine wire after welding is very small, which helps to reduce the need for subsequent cleaning and handling.
Sixth reliable electronic packaging: suitable for electronic packaging applications, to ensure solder joint quality, improve the reliability and performance of electronic components.
Seventh low temperature welding: ultra-fine welding wire usually has a low melting point, which helps to weld at low temperatures and avoid thermal damage to sensitive electronic components.
Eighth accuracy: Due to the extremely small diameter of the ultra-fine wire, the highly precise control of the welding can be achieved, which is suitable for applications requiring high precision and microscopic solder joints.
Basic Info.
product name | Ultra-fine solder wire | brand | singway |
Model NO. | 307003m | Material | Sn Ag Cu |
Melting Point | 227℃ | flux | 1.5%-4.0% |
Specific gravity | 7.41±0.1 g/cm3 | Diameter of the line | 0.1-0.5MM |
Shape | filamentous | Single Volume Heavy | 200 g/roll |
| Product use | Reflow welding of electronic products | Origin | China |
Product Specifications
Model NO. | Ingredient (WT%) | Melting Point(℃） | Diameter of the line | Rosin content |
307003m | Sn Ag Cu | 227 | 0.1MM~0.5MM | 1.5%-4.0% formula size is given according to the operation process |
990 | Sn99Ag0.3Cu0.7 | 227 | 0.4MM~4.0MM | |
| 965 | Sn96.5Ag3.0Cu0.5 | 217~219 |
Product Features
no-clean
halogen-free
Fast soldering
Fast diffusion rate
Less smoke
Low residue
Weld securely
Low spatter
Product advantages
 | Fast wetting speed: Shorten manual packaging and component repair operation cycle. |
 | Minimal flux spatter: safe and easy to use, less plate residue. |
| Good diffusion characteristics: excellent solder joints. |
| Low smoke level: Clean working environment, reduced smoke treatment. |
| Clear non-adhesive residue: no-wash residue suitable for all operations. |
| Good welding appearance: more convenient eye inspection. |
| Halogen-free and halogen-free: meet environmental requirements and high electrical reliability. |
Product specification
Applicable to the industry
Ultrafine solder wire is widely used in microelectronics packaging, electronic assembly, optical fiber communication, precision instruments and medical equipment. It can meet the requirements of high welding accuracy and reliability, and provides important support for the development of these fields.
